Samsung Thermally-Enhanced Chip-on-Film (TECOF) For LCD TVs

Posted: Feb 1 2007, 8:00am CST | by , Updated: Aug 11 2010, 12:53am CDT, in News | Home Entertainment


Samsung Thermally-Enhanced Chip-on-Film (TECOF) for LCD TVs
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There are many aspects companies work on to improve LCD TVs, not just the panel itself. Samsung announced now a new driver IC (DDI) for LCD TVs based on thermally-enhanced chip-on-film (TECOF) package that reduces thermal heat dissipation by 20% over a conventional COF package.

Bigger and Higher-resolution LCD TV panels put more demand on display driver circuits, thus generating more heat.
Samsung has developed a new material for the thin metal tape component that has apparently optimal properties for effectively maximizing heat dissipation.
Samsung has completed reliability testing of the new TECOF package and expects to ship its DDI product with the new TECOF package technology in the 2 nd quarter of 2007.
More details in this Samsung press-release.

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<a href="/latest_stories/all/all/2" rel="author">Luigi Lugmayr</a>
Luigi Lugmayr () is the founding chief Editor of I4U News and brings over 15 years experience in the technology field to the ever evolving and exciting world of gadgets. He started I4U News back in 2000 and evolved it into vibrant technology magazine.
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