There are many aspects companies work on to improve LCD TVs, not just the panel itself. Samsung announced now a new driver IC (DDI) for LCD TVs based on thermally-enhanced chip-on-film (TECOF) package that reduces thermal heat dissipation by 20% over a conventional COF package.
Bigger and Higher-resolution LCD TV panels put more demand on display driver circuits, thus generating more heat.
Samsung has developed a new material for the thin metal tape component that has apparently optimal properties for effectively maximizing heat dissipation.
Samsung has completed reliability testing of the new TECOF package and expects to ship its DDI product with the new TECOF package technology in the 2 nd quarter of 2007.
More details in this Samsung press-release.
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