IBM developed a process called airgap, which enables trillions of microscopic vacuum holes to be placed between the copper wire in chips to act as an insulator.
This process solves the problem of electrical energy leaking between wires, which create unwanted heat.
IBM states that the chips will run 35% faster and consume 15% less energy. IBM developed a method that controls the interaction between self-assembling molecules to create the vacuum holes.
Mr Edlestein, IBM Fellow and chief scientist of the self-assembly airgap project, said: "We have managed to harness the kinds of processes we see in nature to make regular patterns - such as the layers of enamel on your teeth, or the shape of a seashell if you look under a microscope.
More on this on BBC News.