Intel announces the next generation of USB at the Intel Developer Conference.
The Intel Corporation and other industry leaders have formed the USB 3.0 Promoter Group to create a superspeed personal USB interconnect that can deliver over 10 times the speed of today's connection.
USB (Universal Serial Bus) 3.0 will create a backward-compatible standard with the same ease-of-use and plug and play capabilities of previous USB technologies. Targeting over 10x performance increase, the technology will draw from the same architecture of wired USB. In addition, the USB 3.0 specification will be optimized for low power and improved protocol efficiency. USB 3.0 ports and cabling will be designed to enable backward compatibility as well as future-proofing for optical capabilities.
The USB 3.0 Promoter Group consists of the technology, also developed by HP, Microsoft Corporation, NEC Corporation, NXP Semiconductors and Texas Instruments Incorporated.
Intel formed the USB 3.0 Promoter Group with the understanding that the USB-IF would act as the trade association for the USB 3.0 specification. A completed USB 3.0 specification is expected by the first half of 2008. USB 3.0 implementations will initially be in the form of discrete silicon.
A new USB standard will kick off a whole new generation of USB devices. I guess we will already see the first USB 3.0 gadgets at the CES 2008.
Via this Intel press-release.
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