Filed under: | Mobile Phones
Mar 26 2014, 12:41pm CDT | by Ahmed Humayun
The HTC One was surely one of the most highly anticipated launches of this year and finally put a rest to the chain of leaks when it hit the stores yesterday. As soon as the phone was officially launches, within a few minutes it was available for purchase in the stores and since then there have been a handful of reviews on the phone.
But there have been little postings on the net about the inside of the phone and we probably still dont know what exactly is hiding beneath the beautiful skin. Thanks to iFixit, which managed to rip open the phone, we know have an insight into what the phone holds on the inside. This will tell us how repairable the smartphone is and to what extent can it be repaired in case it ends up being damaged like this. To begin with, the case of the phone was torn down which was a pretty simple task according to iFixit. Now comes the good news that this new HTC One is far better than its predecessor and it features a more repairable design mainly because of the spring contacts between the sections of the case rather than cables.
Moving further inside, the main board was reached which revealed the use of glue and this certainly impacts the repairability of the phone in a negative manner. Removing this mainboard showed how the chips and other hardware was packaged onto the mainboard. One surprising bit is that in order to get to the battery, the mainboard has to be taken out and the battery is glued to the LCD shield. On a scale of 1 to 10 (where 10 represents the most repairable), iFixit gave a score of 2 for the HTC One. The major reason for this score is the fact that everything needs to be removed in order for the screen to be repaired.
Ahmed Humayun is a technology journalist bringing you the hottest tech stories of the day.
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