Samsung Galaxy S7 Edge Teardown Details

Posted: Mar 13 2016, 2:09pm CDT | by , Updated: Mar 13 2016, 8:50pm CDT, in News | Technology News


Samsung Galaxy S7 Edge Teardown Details

Samsung Galaxy S7 faced its first teardown last month. Now, it’s time for the other partner, Galaxy S7 Edge to face the same treatment.

The teardown this time, has been done by Chipworks. The teardown has revealed a lot of secrets hiding underneath the beautiful body of the S7 Edge.

Starting with the camera, there is a 12MP shooter which has the dimensions of 12.1 x 12.1 x 5.4 mm.

As per the rumors, there is a Sony IMX260 sensor inside. The exact model of the sensor is not known.

However, we are confirming that it is Sony because there is a Sony logo on the module’s flex cable.

The camera has 1.4 micron pixels, as well as a new Dual Pixel autofocus system.

Moreover, near the camera there is a STMicroelectronics K2G2IS gyroscope, used for optical image stabilization.

As for the chipset powering the device, we have got the latest Qualcomm Snapdragon 820 (model MSM8996) in the T-Mobile version along with 4GB of LPDDR4 SDRAM made by Hynix.

There is also a increase in interconnecting solder bumps between the top and bottom parts of the PoP.

PoP is a package-on-package format in which the SoC is hidden under the RAM. We are not sure what exactly is it intended to do, howeve it can be for higher memory bandwidth or the need to dissipate more heat from the CPU and/or GPU.

The touchscreen controller has been made by the company itself with part number S6SA552X.

The device also comes with a Murata KM5D18098 Wi-Fi module, an IDT P9221 wireless power receiver, Knowles 9291S microphone, an STM LPS25HB barometer and an NXP 67TO5 NFC controller.

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The Author

<a href="/latest_stories/all/all/32" rel="author">Ahmed Humayun</a>
Ahmed Humayun is a technology journalist bringing you the hottest tech stories of the day.




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