A post on Chinese social media surfaced detailing the new MediaTek X30 chip.
MediaTek is reportedly releasing the next flagship chipset in early 2017. In between, MediaTek released a Helio X25 chip, that brings higher clock speeds to the X20 architecture.
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Today a post on Chinese social media is making its rounds that has details of the Helio X30.
According to the post, The X30 is based on TSMC 10nm FinFET technology. It will like the X20 have a 10-core cluster.
The post says it will have 2 A7x (2.8Ghz), 4 x A53 (2.2GHz) and 4 A35 (2GHz). The GPU will be upgraded PowerVR supporting up to 26MP camera, dual camera systems and Virtual reality.
While the performance gets enhanced, MediaTek is supposed to reduce power consumption by half. The X30 is supposed to be available to smartphone makers starting in June. Commercial release is expected in early 2017.
We cannot verify if these new details about the X30 at this time. MediaTek has not made any official announcements about the Helio X30.
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