Be it Apple, Samsung, HTC or any other company, no one can deny that each of them is striving everyday to make their phones thinner with their new releases.
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With the release of the iPhone 7 approaching soon, it has been rumored to have a noticeably thinner design than before.
A report from South Korea also claims that Apple is working on a new technology through which internal space shall be saved more which will result in the re-arrangement of the device leading to a thinner design in turn.
Considering the amazing technology, such a method is tremendous to get away with a few less millimeters of the phone to be released soon.
Apple is hence thought of the first to having use such a technology that shall result in the application of Antenna Switching Module (ASM) which shall enable switching from LTE to others like CDMA, GSM etc. the ‘fan-out’ technology brings together semiconductor chips and silicon chips gelled together through an efficient way to have the new generation iconic iPhone 7.
The technology change shall not only result in having to do away with a few millimeters in design but also change many functionalities such as more improved signal loss problem and lesser interference problems while going wireless.
For it has been rumored that Apple shall use a single chip EMI shield for the same.
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Although Apple is really good at keeping things under the hood even few minutes before the announcement of its products but many rumors are suggesting additional space saved by removing 3.5mm headphone jack and introducing dual stereo speakers in its place as well as employing newly designed smart connector and antenna lines along with sufficient 256 GB storage and dual camera system in the Plus variant.