The last remaining iPhone 7 components surfaced in China.
The Apple iPhone 7 has been leaking part by part of the past months. Now the iPhone 7 PCB board and the Apple A10 CPU have leaked on Chinese social media service Weibo.
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The Apple A10 is made by TSMC with the company's 16nm technology. TSMC is also reportedly producing the S2 chip for the Apple Watch 2 using the same 16nm technology. The A10 CPU is expected to add yet again more performance to the iPhone.
Besides leaking a photo of the A10, GeekBar has also released a video comparing the PCB board of the iPhone 7 (6SE?) with the PCB board of the iPhone 6S. The video is in Chinese.
Last week a working iPhone 7 has been shown off confirming the lack of an audio jack, more pleasing antenna line design and larger camera lens. The leak did not confirm the rumored touch sensitive home button. The full proof for that is still missing, making it one of the last secrets of the iPhone 7. We also still do not know if Apple will release two or three iPhone 7 models. Rumors support both scenarios.
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Based on the latest reports, the iPhone 7 will be unveiled on September 6, pre-order begins September 9 and the sales of the iPhone 7 kick off on Friday, September 16. The iPhone 7 might be called iPhone 6SE. There is no leak yet of the packaging that would confirm the name of the 2016 iPhone. More iPhone 7 News