Hynix and Numonyx announced today that they had extended a five-year agreement to expand their joint development programs for new NAND flash product lines. Under the new agreement, the companies will expand the scope of development efforts to deliver new NAND flash products.
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The two firms will also collaborate on mobile DRAM used in multichip packaged for mobile phones. The DRAM operations will involve a joint manufacturing initiative for the production of 300 mm low power DRAM.
"To become successful in the rapidly evolving semiconductor industry, addressing technology issues jointly rather than independently reduces the risk by leveraging the best of both companies," said Jong-Kap Kim, Chairman and CEO of Hynix. "Future joint technology development will be the key success factor in our alliance and we expect to make significant progress in developing memory solutions by focusing on the introduction of new products through systematic co-development in product, software and controller areas. Together, Hynix and Numonyx will develop a complete range of products on leading edge technologies that will enable both companies to win in the NAND segment. We'll now have one of the broadest NAND design communities in the world and we look forward to continued success as we now work to develop new NAND memory solutions today and in the future."
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