Intel has announced that the development phase for its next-generation 32nm process is complete. The smaller the manufacturing process used to create CPUs, the more CPUs Intel can get per wafer, thus reducing the cost to build CPUs and increasing the number of CPUs built per wafer.
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Smaller manufacturing process also means a cooler chip that requires less power for the end user meaning longer battery run time for notebooks while putting out less heat. Intel says with its 32nm development phase complete it is on track to provide new transistors in Q4 of 2009 using the process.
Current Intel processors are built on a 45nm process. Intel's 32nm process will incorporate second-gen high-k metal gate technology and 193nm immersion lithography to improve the performance and energy efficiency of Intel processors.
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