Intel has announced that it plans to consolidate its manufacturing operations to cut capacity to match current market conditions. The chipmaker will implement these changes without making any impact on the deployment of its new 45nm manufacturing plants and the ramp up for its future 32nm plants.
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Part of the consolidation will see Intel closing a pair of its existing assembly test facilities in Penang, Malaysia and one in Cavite, Philippines. Another facility currently producing 200mm wafers in Hillsboro, Oregon will be closed and wafer production will end at the D2 facility in Santa Clara, California.
Intel says that the consolidation efforts will result in the loss of between 5,000 and 6,000 employees, but not all of the employees will leave the firm. Some of the employees at the facilities being closed will be offered jobs at other plants.
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