Today, scientists at IBM Research and the California Institute of Technology announced DNA Scaffolding for building tiny circuit boards on chips.
DNA Scaffolding is a scientific advancement that could be a major breakthrough in enabling the semiconductor industry to pack more power and speed into tiny computer chips, while making them more energy efficient and less expensive to manufacture than what is possible today.
IBM Researchers and collaborator Paul W.K. Rothmund, of the California Institute of Technology, have made an advancement in combining lithographic patterning with self assembly – a method to arrange DNA origami structures on surfaces compatible with today's semiconductor manufacturing equipment.
The paper on this work, "Placement and orientation of DNA nanostructures on lithographically patterned surfaces" will be published in the September issue of Nature Nanotechnology. The paper is already available on the magazine's site.
Luigi Lugmayr (Google+) is the founding chief Editor of I4U News and brings over 15 years
experience in the technology field to the ever evolving and exciting
world of gadgets. He started I4U News back in 2000 and evolved it into
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