Filed under: News | Technology News
Aug 17 2009, 9:00am CDT | by Shane McGlaun
IBM researchers have devised a new breakthrough that uses DNA to build a scaffold for a circuit board. The advancement in lithographic patterning with self-assembly is a method that arranges the DNA origami structures on surfaces compatible with current semiconductor manufacturing equipment.
The industry is faced with a big challenge to create lithographic technology for sizes smaller than 22nm and the new IBM approach using DNA is promising and may ultimately provide a way to reach the under 22nm lithography realm.
Source: Hartford Courant
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Shane McGlaun
Leading our review center, Shane knows technology inside out. His
extensive experience in testing computer hardware and consumer
electronics enable him to effectively qualify new products and trends. If you want us review your product, please contact Shane.
Shane can be contacted directly at shane@i4u.com.
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