Samsung today began shipping its highest-density OEM (original equipment manufacturer) memory modules ever, punching 32GB of DRAM into a single unit. That's double the company's previous highest-end product.
It's all thanks to Samsung's new DDR3, 4-gigabit chips, which use 40nm lithography and have been in the market less than a year.
It is probably the furthest that the company will go with 40nm technology, as it expands to go even more robust with 30nm. "Our 30nm-class technology will provide even more advanced memory solutions for high-end server and PC applications," said the head of Samsung's memory division Soo-In Cho.
The new module, which is based on dual inline memory (RDIMM) has 36 of the little DDR3 chips, providing enough capacity for nearly 400 gigabytes of data in a single CPU (with 12 of the new units).
Right now the 32GB devices are only being shipped out selectively for testing, but mass availability is expected next month.
Based in New York City, Mark follows the consumer electronics industry like a hawk. A published book author, he has a particular affinity for 3D technology and video games, and as such will surely be in the market for a new pair of glasses soon. Mark can be contacted directly at firstname.lastname@example.org.
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