Samsung today began shipping its highest-density OEM (original equipment manufacturer) memory modules ever, punching 32GB of DRAM into a single unit. That's double the company's previous highest-end product.
It's all thanks to Samsung's new DDR3, 4-gigabit chips, which use 40nm lithography and have been in the market less than a year.
It is probably the furthest that the company will go with 40nm technology, as it expands to go even more robust with 30nm. "Our 30nm-class technology will provide even more advanced memory solutions for high-end server and PC applications," said the head of Samsung's memory division Soo-In Cho.
The new module, which is based on dual inline memory (RDIMM) has 36 of the little DDR3 chips, providing enough capacity for nearly 400 gigabytes of data in a single CPU (with 12 of the new units).
Right now the 32GB devices are only being shipped out selectively for testing, but mass availability is expected next month.