Samsung Ships Highest-Capacity 32GB DRAM Server Memory

Mar 31 2010, 3:39pm CDT | by Mark Raby

Samsung today began shipping its highest-density OEM (original equipment manufacturer) memory modules ever, punching 32GB of DRAM into a single unit. That's double the company's previous highest-end product.

It's all thanks to Samsung's new DDR3, 4-gigabit chips, which use 40nm lithography and have been in the market less than a year.

It is probably the furthest that the company will go with 40nm technology, as it expands to go even more robust with 30nm. "Our 30nm-class technology will provide even more advanced memory solutions for high-end server and PC applications," said the head of Samsung's memory division Soo-In Cho.

The new module, which is based on dual inline memory (RDIMM) has 36 of the little DDR3 chips, providing enough capacity for nearly 400 gigabytes of data in a single CPU (with 12 of the new units).

Right now the 32GB devices are only being shipped out selectively for testing, but mass availability is expected next month.

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Mark Raby
Based in New York City, Mark follows the consumer electronics industry like a hawk. A published book author, he has a particular affinity for 3D technology and video games, and as such will surely be in the market for a new pair of glasses soon. Mark can be contacted directly at mark@i4u.com.