Samsung Thermally-Enhanced Chip-on-Film (TECOF) For LCD TVs

Posted: Feb 1 2007, 8:00am CST | by , Updated: Aug 11 2010, 12:53am CDT, in News | Home Entertainment

 
Samsung Thermally-Enhanced Chip-on-Film (TECOF) for LCD TVs
/* Story Top Left 2010 300x250, created 7/15/10 */ google_ad_slot = "8340327155";

There are many aspects companies work on to improve LCD TVs, not just the panel itself. Samsung announced now a new driver IC (DDI) for LCD TVs based on thermally-enhanced chip-on-film (TECOF) package that reduces thermal heat dissipation by 20% over a conventional COF package.

Bigger and Higher-resolution LCD TV panels put more demand on display driver circuits, thus generating more heat.
Samsung has developed a new material for the thin metal tape component that has apparently optimal properties for effectively maximizing heat dissipation.
Samsung has completed reliability testing of the new TECOF package and expects to ship its DDI product with the new TECOF package technology in the 2 nd quarter of 2007.
More details in this Samsung press-release.

This story may contain affiliate links.

Loading...

Find rare products online! Get the free Tracker App now.


Download the free Tracker app now to get in-stock alerts on Pomsies, Oculus Go, SNES Classic and more.

Latest News

Comments

The Author

<a href="/latest_stories/all/all/2" rel="author">Luigi Lugmayr</a>
Manfred "Luigi" Lugmayr () is the founding Chief Editor of I4U News and brings over 25 years experience in the technology field to the ever evolving and exciting world of gadgets, tech and online shopping. He started I4U News back in 2000 and evolved it into vibrant technology news and tech and toy shopping hub.
Luigi can be contacted directly at ml[@]i4u.com.

 

 

Advertisement

comments powered by Disqus