Recent Leaks Hint Samsung Galaxy S6 Thickness At 6.9mm

Posted: Feb 18 2015, 1:39pm CST | by , in Technology News


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Recent leaks hint Samsung Galaxy S6 thickness at 6.9mm

A California based smartphone case maker OBLIQ has released the case designs of Samsung Galaxy S6

Samsung Galaxy S6 will be launched on March 1st, in Barcelona Spain. Since the launch is near, rumors and news keep popping out every now and then regarding the most awaited smartphone by Samsung. Though a lot of information has already been passed on to the potential customers through various leaks and rumors, however, everything will be cleared on the day of launch of Galaxy S6. This time, there are few confirmations related to the thickness of the smartphone.

A California based smartphone case maker OBLIQ has released the case designs of Samsung Galaxy S6, which further hints that the S6 thickness will be 6.9mm, and with case the thickness goes up to 9.5mm. The various snaps of case design give prominent hints on the location of camera, LED flash and heart rate monitor next to it as well as top and bottom antennas. Early reports have already confirmed that the upcoming Samsung Galaxy S6 will be loaded with a large HD screen display, 64 bit octa core processor, 20 Mega pixel camera with optical image stabilization feature as well as 128 GB of internal storage.

The device will also be installed with a brand new application Samsung Pay, which appears to be a copy of Apple Pay feature. The flagship will be running on Android Lollipop. In addition, reports have also mentioned that the smartphone body will be made with combination of aluminum and glass. More reports appeared this week related to the chipset, Exynos 7 Octa core chipset will be used in the Galaxy S6 as Samsung walked away from Qualcomm partnership recently. Since there have been few complaints regarding heating issues in Qualcomm chip, Samsung considered home-baked Exynos, which apparently have no significant heating issues reported after testing. However, a recent testing of Qualcomm 810 chip has confirmed that it has no heating issues and has more power to process data as compared to Exynos chips.

The big day, March 1st is just few weeks away, as all details related to smartphone handset will be made available along with its reviews.

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<a href="/latest_stories/all/all/32" rel="author">Ahmed Humayun</a>
Ahmed Humayun is a technology journalist bringing you the hottest tech stories of the day.




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