A9 will be much more efficient than the A8 chip
New iPhone 6S schematics have just recently appeared. The schematics were leaked by a user on Weibo.
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The schematics show the design of Apple's upcoming A9 system chip. They further show that the new iPhone will have bizarrely high number of improvements in the system.
Although the new iPhone 6S will be much similar to that of previous iPhone 6 in term of design. For one thing, the revealed chipset drawings show that Apple would to be sure be utilizing a System in Package (SiP) technology.
Apple will also be using Printed Circuit Board (PCB) architecture. The SiP innovation was also as a part of the Apple Watch.
SiP technology takes into account quicker creation of more conservative and more effective hardware. In the event that only a little part of the system turns out defective, however, the entire system goes down the drain.
The schematics additionally show that the CPU protecting cover has heat-dissemination fins. The heat dissipation blades are only 1mm slim.
The processing package is about 15% smaller than the A8 system chip in the iPhone 6. There is additionally no baseband radio imprinted on the motherboard.
It will probably be a different module, although the news is not surprising. The most interesting aspect of the average consumer thing we get to know from these drawings is that; the iPhone 6S will still come in 16 GB, 64 GB and 128 GB versions.
So any basic storage upgrades might eventually be left for next year's edition.
Apple has not confirmed or unveiled anything yet. Since, there are only few weeks remaining for the much anticipated iPhone event.
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The event is scheduled on 9th September. Apple is expected to display the new iPad models, the new Apple TV, and new iPhones during the event.