Filed under: News | Hardware & Peripherals
Nov 18 2008, 9:46am CST | by Shane McGlaun
The new cooling solution is fully compatible with the latest Intel 1366-socketed motherboards with a new retention ring and back plate. The cooling unit promises to cool the 130W Core i7 CPU over 7 degrees C allowing it to run faster.
“The need for speed continues unabated,” states Gary Baum, Asetek’s Senior VP of Marketing & Sales. “By using our LCLC thermal solution, OEMs and system integrators are now able to take full advantage of Intel’s powerful new processors and push the performance envelope to the extreme. Even more powerful workstations and PC gaming machines will be the result.”
Via Asetek
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Shane McGlaun
Leading our review center, Shane knows technology inside out. His
extensive experience in testing computer hardware and consumer
electronics enable him to effectively qualify new products and trends. If you want us review your product, please contact Shane.
Shane can be contacted directly at shane@i4u.com.
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